Email: Office@segen.co.il

 03-9363106 

Segen Technologies Ltd. as a result of its successful partnership with prominent companies in the technology sector and
therefore meeting the demands of its customers, has excelled in the development of new technologies below:

TECHNOLOGIES
  FAILURE ANALYSIS
  • Package Decapsulation - front and back using: chemical, mechanical, laser or plasma precesses.
  • Sample Preparation - Sawing, Grinding, Lapping, Polishing.
  COATING
  • Precision Ultrasonic Spray.
  • ALD - Atomic Activation Process.
   VACUUM PROCESSES
  • Precise Thermal Profiling - Process in Vacuum Oven.
  • Getter activation Process.
  • Rapid Thermal Anealing - RTP.

  PACKAGING
  • IC Package Opening.
  • Reflow.
  • Inert Atmosphere Reflow and Brazing.
  • Fluxless and voidless reflow soldering.
   CONSUMABLES
  • Sputtering Targets, Back Plated, Evaporation Materials.
  • Wafers: Silicon and many other types.











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