|
Segen Technologies Ltd. as a result of its successful partnership with prominent companies in the technology sector and
|
- Package Decapsulation - front and back using: chemical, mechanical, laser or plasma precesses.
- Sample Preparation - Sawing, Grinding, Lapping, Polishing.
|
COATING
|
- Precision Ultrasonic Spray.
- ALD - Atomic Activation Process.
|
VACUUM PROCESSES
|
- Precise Thermal Profiling - Process in Vacuum Oven.
- Getter activation Process.
- Rapid Thermal Anealing - RTP.
|
PACKAGING
|
- IC Package Opening.
- Reflow.
- Inert Atmosphere Reflow and Brazing.
- Fluxless and voidless reflow soldering.
|
CONSUMABLES
|
- Sputtering Targets, Back Plated, Evaporation Materials.
- Wafers: Silicon and many other types.
